Semiconductor Machine Vision inspection

  AOI solution for Wire Bonding /Die Bonding adopts the optical system module and core detection algorithm with completely independent intellectual property rights, as well as AI deep learning algorithm, which is suitable for detecting various defects on the grain surface, solder joints, solder lines and frame surface in the process of fixed crystal and wire bonding, and can be used for efficient AOI detection of defects after the fixed crystal Die Bonding and wire bonding in the semiconductor seal testing field, with characteristics of high speed, high precision and high inspection coverage.    
特色方案 Dual site detection It is applicable to the detection of two stations after semiconductor sealing test D/B and W/B. AOI Inspection algorithm+AI deep learning Using AOI detection algorithm to eliminate background image interference, accurately locate the detection object, focus on detecting various defects in certification, and then use AI deep learning detection algorithm for re evaluation, greatly reducing the misjudgment rate. PCL+Industrial Human Computer Interface Adopting PCL+industrial human-machine interface for equipment operation control and human-machine interaction. Product type switching+synchronous transmission and saving Can quickly switch between detection product types; Support MES networking for synchronizing production data, equipment parameters, and fault shutdown information, with the function of saving cycle numbers.

The wafer scratch solution is mainly applicable to the detection of obvious scratch defects such as missing scratch, defocus, non scratch, twin crystal, etc. of the core particles on the Disco ring after wafer wafer machining. Through visual defect detection, it can detect whether the above defects are included, that is, distinguish between good and bad products, reduce labor, and improve the detection efficiency.    
特色方案 Optical+algorithm High precision high-speed optical imaging system with independent intellectual property rights ensures high-quality imaging effect; The defect detection core algorithm with its own intellectual property rights+AI deep learning algorithm is at the leading level in the industry. shockproof Innovative use of I-shaped shockproof scanning mechanism+marble shockproof platform to achieve stable operation. Automatic report analysis system The original background automatic report analysis system realizes mapping and report output. Automatic image classification Visual data backup and data tracing, automatic image classification, convenient for users to query and review; The equipment is reliable and has long trouble free working time.

The shape and distribution of dislocation defects in the preparation of semiconductor wafers have a great impact on the performance of electronic components. Due to different doping materials and preparation processes, the dislocation distribution is also different. This solution is mainly aimed at the shape and distribution of wafer dislocations, and is committed to providing data support for wafer material research and improvement of preparation process. It is applicable to 2-inch, 3-inch, 4-inch and 6-inch GaAs substrates.    
特色方案 Convenient and efficient Convenient and efficient surface defect detection equipment for wafers, substrates and epitaxial wafers. Main defects: dislocations, particles, pits, scratches, stains, etc. Improve efficiency and accuracy It replaces manual sampling inspection and greatly improves the detection efficiency and accuracy. Data support+automation Check the dislocation density, morphology and distribution of the substrate and epitaxial wafer to provide data support for substrate material research, defect traceability, and improvement of preparation process; Automatic image acquisition and artificial intelligence analysis tools. High quality service Reliable equipment, long trouble free working time, fast response+high-quality after-sales service.

This scheme is mainly used for thickness measurement of wafers and display panel processes (such as wafer slicing, grinding, thinning, slicing, etc.). Can synchronously test the parameter errors such as TTV, BOW, WRAP, and SORI of the material itself.    
特色方案 Accurate and fast High precision, fast measurement speed, and can achieve precise and fast process control. Widely applicable Used to check the thickness of any working part surface. Visual assistance With visual assistance, automatically locate the position of the wafer on the substrate. Satisfy personalized needs Programming is simple, fast, easy to configure, and can meet the personalized needs of different customers.