ACF gold finger glue overflow detection

The AVI inspection machine for appearance defects of 3C products is mainly used for defect detection of 3C product appearance, improving production line yield and the process control capability of manufacturers. The main application areas include mobile phones, laptops, tablets, LCD modules, wearable devices, televisions, etc.   The detectable defects include surface scratches, burrs, damages, pressure marks, broken edges, notches, hidden cracks, burrs, warping, foreign objects, dirt, white spots, bubbles, pinholes, bumps, etc.  

Desktop module appearance AVI inspection is mainly used for defect detection of 3C product appearance, improving production line yield and the process control capability of manufacturers. Mainly detecting scratches, damages, pressure marks, broken edges, gaps, hidden cracks, burrs, warping, foreign objects, dirt, white spots, bubbles, pinholes, bumps and depressions, as well as component errors, leaks, reversals, excess, skewers, offsets, color differences, sizes, segments, etc.

The backlight module is one of the key components of LCD display panels, which functions to provide sufficient brightness and evenly distributed light sources to display images normally. Its luminous effect will directly affect the visual effect of the LCD display module, so the quality of the backlight module is particularly important. The AOI inspection machine for appearance defects of the backlight module can inspect the quality of the backlight module during the process to ensure its quality. The appearance defects of the backlight module include: dirt, scratches, white sides, foreign objects, exposed film materials, film displacement, missing wires, tape climbing, concave frame, high and low backboards of the frame, missing tape, FPC offset, etc; The AOI inspection machine for appearance defects of backlight modules is used to replace manual visual inspection and achieve machine replacement.

FPC bonding can achieve efficient and stable circuit connections. ACF adhesive is used for bonding TAB or COG of LCD panels, which requires high technical content and accuracy. After PCB bonding, ACF gold finger overflow defects often occur. This machine mainly detects ACF gold finger overflow defects to improve the production line yield.