Production Operation AI Monitoring System
The production operation AI monitoring system (production operation error prevention AI monitoring system) can collect the operation process, the movement trajectory of employees and equipment, identify errors such as missing, wrong, missing, and missing in production operations, including employees' picking actions, movement trajectories, insertion positions, etc., and issue timely alarms. This not only improves production efficiency, but also reduces product quality problems caused by human errors.
In addition to real-time monitoring, the system can also monitor the compliance of the production process, retain and audit production related records and data, which is of great significance for the compliance management and risk control of enterprises.
FPC bonding can achieve efficient and stable circuit connections. ACF adhesive is used for bonding TAB or COG of LCD panels, which requires high technical content and accuracy. After PCB bonding, ACF gold finger overflow defects often occur. This machine mainly detects ACF gold finger overflow defects to improve the production line yield.
The FPC flexible circuit board bonding foreign object inspection machine is used to detect defects such as FPC misalignment, bubbles, various foreign objects, and missing particles after FPC bonding.
Using an array camera for double-sided shooting, taking defective images, extracting defects through software algorithms, designing different software algorithms for processing and classification according to different defects, and adjusting detection specifications based on algorithm thresholds.
Real time monitoring of the bonding quality of the production line, equipment alarms remind employees to handle batch defects in a timely manner, greatly reducing the occurrence of defective products and preventing them from flowing to the next post.
The bonding foreign object detection system is used to detect foreign objects in the pictures of friendly particle indentation inspection machines. Due to the inability of particle indentation inspection machines to detect defects such as scratches, foreign objects, and fragments, it may miss detection. Our bonding foreign object detection system can detect the above defects and improve the yield rate of the production line.