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Wire/Die Bonding AOI inspection machine
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Wire/Die Bonding AOI inspection machine

Wire/Die Bonding AOI inspection machine

Solid state wire bonding AOI inspection machine, also known as wire bonding AOI inspection machine, is mainly used for efficient AOI inspection of defects after die bonding and wire bonding in the semiconductor packaging and testing field. It has the characteristics of high speed, high precision, and high inspection coverage. Optical system modules and core detection algorithms with completely independent intellectual property rights, as well as AI deep learning algorithms, are suitable for detecting various defects on grain surfaces, solder joints, solder wires, and frame surfaces that occur during the solidification and wire bonding processes.

Project

Performance index

应用领域

IC field, power devices (IGBT, etc.), SIP, discrete devices, COB, optical communication field, lighting LED MiniLEDMicroLED Lead frame, etc

检测范围

晶粒检测

Detection of missing grains, angles, sizes, positions, chipping, scratches, cracks, overlaps, foreign objects, dirt, surface coatings, etc

焊点检测

Solder joint size, offset, virtual soldering, wire warping, etc

焊线检测

Missing gold wire, collapsed wire, inverted wire, broken wire, bent wire, re welding, line width, high arch height, low arch height, etc

胶水/焊锡检测

Glue coverage, offset, overflow, grain surface on glue, tail pulling, solder splashing, bridging and tin sticking, bubbles inside the glue, impurities, etc

框架/引脚检测

Frame/pin connections, defects, bends, dirt, foreign objects, etc

光学系统

5-megapixel color industrial camera with a resolution of 15um

Far center lens+customized combination light source

运动机构

Track type fully automatic loading and unloading conveyor, with a track width of 40-70mm that can be automatically adjusted for tray or sheet operation, and the track width can be customized

The movement of the material tray or sheet in the track is carried out by a screw module and driven by a motor

Support automatic line stringing or automatic loading and unloading, automatic loading and unloading support multiple forms and specifications, can be selected or partially customized according to product or vehicle specifications

软件系统

1. Humanized operation interface, users can set access permissions for different groups according to their needs (unlimited number of groups);

2. It has detailed historical batch detection information, as well as missing path analysis and measurement analysis functions;

3. Mapping information for defects can be provided to subsequent processes in formats such as CSV files, TXT text, HTML files, HTTP API requests, and SQLite data files;

4. When the device alarms, the interface displays information clearly and has the function of recording and querying historical alarm information;

数据管理

Data analysis tools, including historical data queries, yield analysis, defect statistics, and mapping defect distribution, etc

激光烧断

The laser module is integrated into existing equipment, and for defective products detected during inspection, laser burning treatment is carried out

缺陷图片

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Solid state wire bonding AOI inspection machine, also known as wire bonding AOI inspection machine, is mainly used for efficient AOI inspection of defects after die bonding and wire bonding in the semiconductor packaging and testing field. It has the characteristics of high speed, high precision, and high inspection coverage. Optical system modules and core detection algorithms with completely independent intellectual property rights, as well as AI deep learning algorithms, are suitable for detecting various defects on grain surfaces, solder joints, solder wires, and frame surfaces that occur during the solidification and wire bonding processes.

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